R&D Elektronik
Extreme conditions require extremely good service partners
PCB coating
Durable and reliable operation even under severe environmental conditions? R&D Elektronik can provide any type of PCB coating to ensure full functional safety and reliability of the end product.
However, it is not only in adverse operating conditions that a coating may be advisable.
Our measures offer the best possible protection against moisture, condensation, chemicals, corrosion-induced leakage currents or ‘simple’ contamination of surfaces, as well as against shock and vibration and the resulting damage.
As a full-service EMS provider, we understand that our services do not end with the coating process. Advice, review of assemblies for coating possibilities and requirements, determination of the appropriate process, manufacture of customised equipment for the safe coating of all areas of a printed circuit board and intensive coordination with our customers in the event of foreseeable adversities are standard at R&D Elektronik.
Painting
R&D Elektronik protects your sensitive components from the environment with thin-film, thick-film or additive multi-coatings.
The subsequent impact and the nature of the assemblies determine the choice of paint and protective coating. Rely on our specialists for analysis and implementation, because painting is not just a simple coating process: Paint can cause unwanted heating, spray mist or capillary effects can cause defects and malfunctions in connector pins, for example.
Depending on requirements, R&D Elektronik uses selective conformal coating to omit connectors, switches, sockets, receptacles, relays or LEDs and other sensitive or moving parts during painting. If necessary, manual painting is used.
The coating can be soldered through for repair purposes. It is also checked for complete wetting using UV light and a coating thickness gauge.
Potting
Painting does not meet the requirements?
R&D Elektronik naturally also offers the highest level of protection: encapsulation of the components.
Full or optional selective potting is achieved by applying or encapsulating a liquid 1 or 2 component potting compound onto the PCB or housing until all components are encapsulated. The potting compound is either applied directly to the PCB or the assembly is fully encapsulated in a housing.
We pay attention to the highest physical and chemical standards, using vacuum potting where necessary to ensure there are no bubbles or, for example, transparent material for LEDs. If the assemblies are subject to large temperature fluctuations, we use soft potting, for example, which allows the module to expand.